Dear all, I am using su-8 in photolithography technique. I'm having difficulty when handling it. The adhesion strength of su-8 and silicon is not very even. I clean the silicon wafer in piranha solution, give it a oxygen plasma treatment and use the Mcc primer (microchem). After 1.5 minutes developing some patterns will peel off. M mask dimension is only 10microns. Has anybody encountered this problem? Is the adhesion strength decided by the softbake time or post bake time or both? Should I increase the baking time for both? Any suggestions will be highly appreciated. Thanks a lot in advance.