Hi everyone,

The process flow is :

1) Si ,DRIE
2) Spincoat AZ5214E ,fill the trench completely  then expose and develop
remove the suface PR , remain the bottom PR in the trench
3) Anodic bonding with  7740 Glass
4) thinning

Could the remained PR  influence the anodic bonding process during 400degree C?

Thanks ,

--
Yan Xin
-Pen-Tung Sah MEMS Research Center,
-Xiamen University, CHINA
XMU HOME:
http://memsc.xmu.edu.cn/mems_renchaiduiwu/XuYuan_Chen-Group/index_1.html