Thanks for the suggestion.

SU8 has to be on the surface on both Si (actually SOI wafer) and Pyrex wafers
before bonding.

I have released structures on the SOI wafer such that SU8 application and
development is prohibited.

If anyone has experience with bonding using one SU8 layer will be appreciated.

Thanks,
Yasser Sabry






________________________________
From: Mike Whitson 
To: yasser_sabry82@yahoo.com; General MEMS discussion 
Sent: Fri, April 22, 2011 3:42:31 AM
Subject: Re: [mems-talk] Patterning UV Epoxy

Hi Yasser,

SU-8 has apparently been used as a bonding layer, and appears to match your
requirements.  I believe the microfluidics people use that kind of process
relatively regularly; I've seen it turn up in designs for adaptive optic devices
too, though I don't have personal experience implementing such a process.
Suppliers are MicroChem (microchem.com) and Gersteltec (gersteltec.ch), though
many MEMS labs will probably already have some.

Normal "UV epoxy" products sold as adhesives rather than photoresists are not
designed for photopatterning; simply for a blanket UV curing process.  It's
unlikely the pattern fidelity would be very high if you tried to selectively
cure and somehow develop them.

A quick literature search for "su-8 bonding" turns up several references.  The
first citation I found which seems to be pertinent: Li et al, J. Micromech.
Microeng. 13 (2003) 732–738, "Fabrication of micronozzles using low-temperature
wafer-level bonding with SU-8".  Sure you'll be able to turn up more with some
digging.

Good luck,
Mike

On Apr 21, 2011, at 19:19, yasser sabry wrote:

> Does any one know a UV epoxy that can be spin coated on the wafer and
patterned
>
> using UV exposure and developed using any chemical?
>
> I want to use to bond two wafers together and I have to pattern/etch it from
> places of my structures.
>
> Please if you know tell from where I can get it.
>
> Thanks,
> Yasser Sabry