Hi everybody, I want to use PMMA (with underlayer of copolymer) for E-beam writing over an insulating substrate (most probably glass). In order to make it possible I'm going to deposit copper on top of PMMA. After exposure I'm going to get rid of copper prior to development, by immersing the thing in FeCl3 solution in water. It dissolves copper really quickly. However I'm wondering if that will affect PMMA (both exposed and non-exposed). I'm not concerned with Fe or Cl - I'll wash them away with water. If anybody knows something about PMMA-FeCl3 interactions, I'll appreciate an answer. Jarek Jaroslaw Syzdek Ernest Orlando Lawrence Berkeley National Laboratory Environmental Energy Technologies Division Advanced Energy Technology 1 Cyclotron Road MS70R0108B Room 193 Berkeley, CA 94720-8168 (GMT-8) United States of America tel1: +1 510 486 4678 tel2: +1 510 486 4360 fax: +1 510 486 7303 www.lbl.gov http://eetd.lbl.gov/staff/syzdek-j.html https://sites.google.com/a/lbl.gov/jarek/