Hi All, We sputtered CrAu metal films onto a layer of silicon dioxide on the topside of silicon wafers, then thickened the Au film by electroplating to about 3 microns. We did the film adhesion test by spot-wielding Au tape and pulling the Au tape. Sometimes the film under the wield spot were pull off, sometimes not. While doing the Ultrasonic/Thermosonic tape bonding and pulling test, it shows that the film adhesion is good. It seems that Some batch of CrAu films couldn't bear temprature shock by spot- wielding. How could we improve the tolerance of CrAu films to high temperature shock? Does anyone has the similar experience? Thanks!