Hi,

I am looking to work with PI-2574 to make Microfluidic channels of
thickness around 50 um. I have been informed by the supplier that I can
make the channels with 50 um thickness by spinning the PI and partially
cure it, then spin more PI and partially cure it until I reach my required
thickness. Then do the full cure. I am now interested in knowing the RIE
etch rate of PI-2574. Can you please inform me if I can use mixture of O2
and SF6 to RIE pattern PI or any other gas mixtures (not involving CF4 as
we don't have it in our machine). It would be nice if you can suggest me a
non-conductive mask to pattern PI.

Thank you

Regards,
Azeem
Phd-Student
Technical University Denmark