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Davies, Mike
1999-06-04
Message-ID:   <83B0B0B52B02D311AA340004ACE8E16740DF6D@NRCMRDEX1>

        >I am looking for someone to provide photolithographic patterning as
a
        >service.
        >
        >Lithography requirements are:
        >
        >-3 inch wafers of InP but also possibly GaAs or Si, possibly 4 or 6
inch
        >later.
        >
        >-reticule will be 4 inch for 3 inch wafers.
        >
        >-X5 reduction required, (1:1 projection not acceptable)
        >
        >-365 or 248nm exposure, 248nm preferred
        >
        >-Die size approx 15mm by 5 mm
        >
        >-Field size 15mm by 15mm ie 3 dies per field. Larger field is OK
        >
        >-CD 2.5 micron with 3 sigma better than 0.05 micron across a six
inch
        >wafer (equivalent)
        >
        >-Pattern required in resist on oxide coated (approx 0.1 micron
thick)
        >wafer. This is first photolithographic step.
        >
        >- Volume, tens of wafers per year possibly more
        >
Email: mike.davies@nrc.ca 


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