Hi Lina,
My thin film head experience is - Sputtered (PVD) deposited NiFe will stick
pretty well to oxides like glass or Alumina. NiFe/alumina is used in
production. Refractory metals will stick the best to oxides and coinage
metals the worst.

This is it -
Metals like Al, Ti, Cr, Ta having a high affinity for oxygen will stick well
to oxides like glass. Gold, copper or platinum with a low affinity for
oxygen require an adhesion layer like TiW or Ta.

I hope this helps,
Dave

David Roberts (Wafer Plating Specialist)
Prodigy Surface Tech (408) 469-3203 cell
807 Aldo Ave., Suite 103
Santa Clara, CA 95054
Phone (408) 492-9390
FAX (408) 492-9391


-----Original Message-----
From: Lina Gonzalez [mailto:lmgonzal@andrew.cmu.edu]
Sent: Friday, March 09, 2012 7:12 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Intermediate layer of tantalum

Hi all,

What is the special interaction between sputtered tantalum on glass that
makes tantalum stick to glass? For example, why would you want a Ta layer
before depositing NiFe when having a glass substrate?

Thanks,

Lina




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