Hello Peter,

Are you planning to direct fusion bonding bare sapphire to bare
sapphire, or sapphire to another substrate?

Is there any medium in between?

Any cavities that needs specific pressure encapsulated?

Alignment requirement?

Substrate size?

If the substrates are:

Surface roughness less than 1.0 nm Rms

TTV is less than 3 microns

Bow is less than 20 microns for 100 mm diameter

There is high opportunity for plasma surface activated direct fusion
bonding.

Best Regards,

Tian Tang

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