If the ultrasonic was effective at removing the contamination, then
Megasonics will likely work and be much less likely to damage the combs.
They are also effective at cleaning down into recessed areas, trenches, etc.

Expect to pay considerably more than you would for an ultrasonic due to more
sophisticated electronics and manufacturing methods but there are tabletop
models that are reasonably priced.

Mark West
Imtec Acculine - Celebrating 40 years of quality products and innovation.
p: 510.770.1800 ext.112
e: mwest@imtecacculine.com
w: www.imtecacculine.com
    See us on Youtube


The content of this message including attachments is Imtec Acculine, LLC
Confidential. If you are not the intended recipient and have received this
message in error, any use or distribution is prohibited. Please notify me by
reply e-mail and delete this message from your computer system. Thank You.
-----Original Message-----
From: ProtoSi Info [mailto:info@protosi.com]
Sent: Tuesday, July 24, 2012 12:22 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] dicing particle contamination

Hello

We've been struggling with particles getting embedded in our delicate
silicon comb structures during dicing. Our current process involves
spraying on a 10um thick layer of photoresist over the entire wafer and
then do a soft bake. After dicing we rinse the wafer to remove particles
before stripping off the resist. However we're still getting particles
stuck in-between the comb fingers. We've attempted ultrasonic cleaning but
that damages the combs.

Any tips to remove or prevent particles would be greatly appreciated.

Thank you
Kevin Chang
ProtoSi



_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

Want to advertise to this community?  See http://www.memsnet.org

To unsubscribe:
http://mail.mems-exchange.org/mailman/listinfo/mems-talk