Hello Dr. Macfarlane,

I answer your questions as follows:

>I am attempting to build a simple anodic bonder (based on another product
>which has a 6" heated platen).
>
>Could anybody tell me, is there any reason that we have to test it under
>vacuum, other than to keep air bubbles and particles out of the bond?
------------As I know, anodic bonding is usually processed in the air rather
than under vacuum. Some reports that bonding under vacuum is slower than in
the air. Using point negative electrode rather than plane electrode can
prevent the air bubbles.

>Also, where can I get a small quantity (say 5 off) of  4" or 6" silicon
>wafers, sputter coated on one side with 4 microns of pyrex, and also a
>similarly small  quantities of thin pyrex frits, between 0.5 and 2 mm
>thick?
>
>
>I take it that if I am bonding Si to glass, that I don't need to sputter
>coat the Si i.e. that this is only necessary to bond Si to Si?
--------------Yes.

Yahong
------------------------
Yahong Yao
705K University Village
Columbia, MO 65203
Tel: (573)771-0382
Email:hhelen@hotmail.com

>
>Dr. Ken Macfarlane,
>Development Dept., Logitech Ltd.,
>Erskine Ferry Rd., Old Kilpatrick,
>Glasgow G60 5EU, Scotland.
>Voice: 01 389 804405 (direct dial)
>Fax :  01 389  879042
>Work: ktm@logitech.uk.com
>website: www.logitech.uk.com
>
>
>




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