Dear all,
Thank you so much for your comments and advises.
I got better results by using dynamic dispensing at 1500 rpm, although I'll go
through the other strategies you proposed.
I'll be sure to let you know if I can find a good, simple solution for this
issue.
Thanks again, and happy holidays to you all!
-----------------------------
João Tiago dos Santos Fernandes
INESC Microsistemas e Nanotecnologias (INESC MN)
Rua Alves Redol, 9
1000-029 Lisboa
Portugal
Tel: +351 213100237
Email: jfernandes@inesc-mn.pt
URL: www.inesc-mn.pt
On Dec 21, 2012, at 18:36 , Lukasz Urbanski
> wrote:
this may help:
http://microchem.com/su_eight_faq.htm
Happy Holidays
2012/12/20 Gareth Jenkins :
Perhaps try covering the wafer in the resist solvent before pouring the
resist? This may help fill the gaps.
On 21 December 2012 02:57, João Tiago dos Santos Fernandes <
jfernandes@inesc-mn.pt> wrote:
Hi everyone,
I'm currently using AZ 40XT thick photoresist to make a 20-30 µm thin film
over a Si sample with ~30 µm high SU-8 features.
The problem I am facing is the following: when I pour the AZ on top of the
sample, tiny air-bubbles are created in areas where SU-8 features are small
(small wells, gaps, etc) - I'm guessing that this happens because the AZ is
very viscous and isn't able to fill those spaces and traps air. When I spin
coat, those tiny air bubbles are spread across the sample, compromising the
process.
Is there any way to get the air bubbles out of the way without
compromising the final film thickness? I tried low rpm for a couple of
minutes, with no success.
Thank you so much,
-----------------------------
João Tiago dos Santos Fernandes
INESC Microsistemas e Nanotecnologias (INESC MN)
Rua Alves Redol, 9
1000-029 Lisboa
Portugal
Tel: +351 213100237
Email: jfernandes@inesc-mn.pt
URL: www.inesc-mn.pt
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