Hi
you can do this. use 35KRPM. you will not get a nice cut because of the large
diamond particle size required to cut Pyrex.
if you need a better cut with less chipping, you will have to use a nickel blade
with less than 10u diamond. the nickel blade is also better because the resin
blades sometimes get rounded at the corners and as you use it more and more you
will not gwet a straight cut unless you go very deep into the support tape.
Shay

----- Original Message -----
From: Emre Olceroglu 
Date: Wednesday, January 30, 2013 21:23
Subject: [mems-talk] Dicing silicon with diamond blade
To: mems-talk@memsnet.org

> Hello,
>
> I was wondering if I can dice 0.5mm silicon wafers with diamond
> blades that we normally use for Pyrex dicing.
>
> I know people dice bonded Silicon-Pyrex but I am not sure which
> blade they use.
>
> Thanks.
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