Hello, We are having problems with dies being stuck to electrostatic chuck after double side etching of SOI wafers, causing the wafers to break when trying to separate them from the chuck. I was wondering if anyone has an idea of how to prevent/reduce it? Thanks! _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk