Hi all, I am defining now a scrubber machine to be used in my process. The purpose of the machine is to do surface preparation to the wafer before it enters the line. What is the standard mechanical method for scrubbing? Is it a rotating brush pressured on a spinning wafer or a disc brush in the diameter of the wafer pressured from above the wafer as in CMP processes? It seems to me that with the second option (disc) it is easier to control the process on the wafer and to ensure that every surface of the wafer receives the same amount and pressure of scrubbing. Thanks Amos _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk