If the diameter of the vacuum intake is small enough, let's say you have
a 3 mm pipe, then the wafer is safe even if you use a strong rotary
pump. If you use really thin substrates, like microscope cover slides,
than you should user a strong support plate and stick the thin substrate
to the plate by the help of a droplet of isopropanol. And of course the
support plate is soaked to the vacuum inlet.



Am 06.12.2013 20:07, schrieb Nathan McCorkle:
> I am trying to build a vacuum chuck for spinning, and can't figure out
> if a common laboratory roughing vacuum pump would break a silicon
> wafer. There is some distance from the center of the chuck to the
> O-ring(s), but how much? And the vacuum will never apply more than
> 14.7 PSI (at sea level), right?
>
> This mentions silicon surviving >10000 PSI, but is that an ingot or
> rod or wafer, I can't tell.
> http://www.me.berkeley.edu/~lwlin/me119/papers/paper9.pdf
>

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