Hi all, I am looking for an adhesion layer for semiconductor device bonding. What are the differences between BCB and SU8, in terms of their adhesion strength, temperature stability, chemical stability, etc? Thank you. ------------------ Best regards, Xing Sheng 2014-03-27 _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk