When I was ashing S1800 photoresist using Pure O2, I noticed the following:
After 5 min, or 7min, the photoresist layer stayed the same. The layer is
only 0.5um thick to begin with.
But if I look at it after 10min, all PR is gone.  Seems it is hard to find
the middle point.
Does the O2 plasma turn everything in ash first and then poof, everything
is gone? I thought it
etch layer by layer.

Power is pretty low, 200W, 0.1-0.2torr. Pure O2, RF plasma.

-Andy
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