Hello,
  Several days ago, I sent an email to mems@isi.edu as follows. Yesterday,
as I checked my email box, my computer shutdown suddenly before I could see
the mails, even the names of the writers. Those letters were all lost.
  But I noticed some of you answered my questions. Thank you for your help
very much. I will be very grateful if you send the letters again, the
process parameters are very important for me. I am sorry for the troubles I
make.

Best regards


>Dear MEMS community,
>  I would like to ask if anyone has experience of Au-Au bonding on silicon
substrates.
>We want to know the bonding temperature, pressure and the thickness of the
Au layer.
>
>
>
>Thanks very much.
>Regards
>Junhua Zhu
>_____________________________________________________
>
>Junhua Zhu
>MEME Research Group
>Department of Precision Instruments
>Tsinghua Univ.
>Beijing
>P.R. China
>100084