I would appreciate any information on hybrid packaging suppliers
including DIP, CDIP, and SOIC, particularly those that specialize in
small outline packages.  Thank you.

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____________________________________
Toshikazu (Toshi) Nishida
Associate Professor
Department of Electrical and
  Computer Engineering
Interdisciplinary Microsystems Group
459 EB, P. O. Box 116130
University of Florida
Gainesville, Florida  32611-6130