Hi, Just ran across the references to EFAB (a technique somewhat similar to LIGA) out of USC. True 3-D structures can be made (compared to 2.5D LIGA structures) by depositing multiple thinner layers. Of all the web pages I looked at, most were lacking in technical details. The article from the EE Times had some useful information. Until I run down some of the refs, does anyone have any insights into this process? - It sounds like an anode with an insulating mask is placed in close proximity to the substrate before plating. How is the resolution maintained from the anode mask to the cathodic substrate? Are the walls close to vertical? -Are the multiple masks reusable? -There are still alot of steps. What resist or dielectric is used for anode masks? What type of polishing is used to planarize the copper / nickel surface? -Anyone have any electronic versions of the literature available? Thanks in advance, Jaime -