Here's the thermal conductivity for an epoxy mold used in BGA packaging
to get you started:

PLASKON-SMT-B1                  Thermal conductivity, Isotropic
KXX=KYY=KZZ=0.71 W/m*K

Here's Plaskon's link http://www.amocochem.com/PlaskonSite/smtb1.html
and another link with some other epoxy data
http://www.epoxies.com/potting.htm

Sorry, no data on hand for heat capacity, you would only need this in
addition to the thermal conductivity for a transient thermal analysis.

Kind regards,

Paul.
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> Paul Lethbridge
> Electronics Industry Specialist
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