Dear Jaime,

please see our website (http://www.microtec-d.com) for information about our
technologie RMPD for the production of 3dimensional microstructures.

Best regards

Andrea
microTEC, Germany
-----Ursprüngliche Nachricht-----
Von: Jaime Poris [mailto:jporis@nanometrics.com]
Gesendet: Donnerstag, 5. August 1999 01:21
An: MEMS@ISI.EDU
Betreff: EFAB


Hi,
   Just ran across the references to EFAB (a technique somewhat similar to
LIGA) out of USC.  True 3-D structures can be made (compared to 2.5D LIGA
structures) by depositing multiple thinner layers.  Of all the web pages I
looked at, most were lacking in technical details.  The article from the EE
Times had some useful information.  Until I run down some of the refs, does
anyone have any insights into this process?
- It sounds like an anode with an insulating mask is placed in close
proximity to the substrate before plating.  How is the resolution
maintained from the anode mask to the cathodic substrate?  Are the walls
close to vertical?
-Are the  multiple masks reusable?
-There are still alot of steps.  What resist or dielectric is used for
anode masks?  What type of polishing is used to planarize the copper /
nickel surface?
-Anyone have any electronic versions of the literature available?
Thanks in advance,
Jaime
-