Joe Since MEMS is still considered in its infancy no books exist as to be related to MEMS itself. Packaging should be similar to regular IC packaging dependant upon the usage of the MEMS device. I know that accelerometers are packaged the same as non-MEMS based. With new types of devices this area may need to be researched. MEMS quality, this also is in even more of an infancy stage than mainstream MEMS. Quality of MEMS is relivant to its utilization. If it is simplistic, you could probably use conventional semiconductor quality to analyze. Your more specialty items or more complex will require material analysis that has only just recently been done in the industry, and it is still far from being very usefull for any modeling. You could start by doing a search on the internet for MEMS Quality or MEMS Reliability. Also try Sandia National Lab web site they are doing some research into MEMS quality and reliability. http://www.mdl.sandia.gov/Micromachine/index.html There are other sites out there especially colleges and universities doing research, but most are just beginning their projects. James W. Carroll Jr. Reliability Engineer Product Assurance Dir. Missile Research, Developement and Engineering Center US Army Aviation and Missile Command ____________________Reply Separator____________________ Subject: MEMS Packaging and Quality Assurance Author: Joe BradleyDate: 8/30/99 1:01 PM Hey Fellow Researchers, I am currently literature review for information regarding Packaging and Quality Assurance testing for MEMS. Does anyone know of any publications or books that could provide some information. Thanks, Joe Bradley -------------------------- Joe A. Bradley Engineering Animation Inc. 2321 North Loop Drive Ames, IA 50010 515-296-6071 1-888-324-3423 -------------------------- "I am what I am by the Grace of God" Received: from pcgw1.redstone.army.mil ([136.205.157.100]) by fhssmtp.REDSTONE.ARMY.MIL with SMTP (IMA Internet Exchange 3.11) id 001D8848; Thu, 2 Sep 1999 20:33:50 -0500 Received: from ns1a.redstone.army.mil (ns1a.redstone.army.mil [136.205.14.100]) by pcgw1.redstone.army.mil (8.8.6 (PHNE_14041)/8.8.6) with ESMTP id UAA29730 for ; Thu, 2 Sep 1999 20:34:54 -0500 (CDT) Received: from darkstar.isi.edu (darkstar.isi.edu [128.9.128.127]) by ns1a.redstone.army.mil (8.8.6 (PHNE_14041)/8.8.6) with ESMTP id UAA07728; Thu, 2 Sep 1999 20:34:44 -0500 (CDT) Received: (from daemon@localhost) by darkstar.isi.edu (8.8.7/8.8.6) id QAA11093 for mems-out-list; Thu, 2 Sep 1999 16:52:57 -0700 (PDT) Received: from tnt.isi.edu (tnt.isi.edu [128.9.128.128]) by darkstar.isi.edu (8.8.7/8.8.6) with ESMTP id QAA11089 for ; Thu, 2 Sep 1999 16:52:55 -0700 (PDT) Received: from k2.isi.edu (k2.isi.edu [128.9.128.136]) by tnt.isi.edu (8.8.7/8.8.6) with SMTP id QAA21701; Thu, 2 Sep 1999 16:52:54 -0700 (PDT) Posted-Date: Mon, 30 Aug 1999 13:01:43 -0500 Message-Id: <9909022352.AA04416@k2.isi.edu> Received: by k2.isi.edu (4.1/4.0.3-4) id ; Thu, 2 Sep 99 16:52:54 PDT Date: Mon, 30 Aug 1999 13:01:43 -0500 From: Joe Bradley Subject: MEMS Packaging and Quality Assurance Mime-Version: 1.0 Content-Type: text/plain; charset="us-ascii" To: MEMS@ISI.EDU X-Url: http://mems.isi.edu/mems.html Reply-To: Joe Bradley , mems-cc@ISI.EDU