We're doing some silicon micromachining with 5% TMAH at 80 degrees C. The
sloping silicon sidewalls of the micromachined vias are somewhat nonuniform,
not nearly as perfect as with KOH. Is this a characteristic of TMAH or are
there parameters that can be tweeked to overcome this problem?

Thanks,
Kevin
--
Dr. Kevin M. Walsh
Electrical Engineering Department, Speed Scientific School
University of Louisville, Louisville, KY 40292
(502) 852-0826

Internet address: kmwals01@starbase.spd.louisville.edu