durusmail: mems-talk: MCNC TechNet Kick-off (text version)
MCNC TechNet Kick-off (text version)
1995-12-04
MCNC TechNet Kick-off (text version)
Jason Hoch
1995-12-04
MCNC MEMS TechNet Kickoff

The MEMS Technology Applications Center at MCNC is proud to announce the
kick-off of the MEMS Technology Network (MEMS TechNet). TechNet is an
ARPA-supported program that increases the variety of processes and services
available to MUMPs and general MEMS users, through access to modular-based
process technologies at finer-granularities than currently available. Process
modules and services will be integrated from both MCNC and external
organizations with processes and services of interest and value to the MEMS
community.

Initial offerings for TechNet include bulk micromaching substrates consisting
of low-stress silicon nitride on DSP silicon and surface micromachining
substrates consisting of a film stack of oxide/poly/oxide/nitride on SSP
silicon.

TechNet's backbone is a WWW-accessible user's information and reservation
system that enables clients to access data describing the available modules,
add-ons and the schedule of regular runs. Online tutorials, examples and
engineering support are available for less experienced users. Specifications,
datasheets and design rules for all available modules and add-ons are also
available online.

MEMS TechNet is now available on the World Wide Web at our new web address.
Please go to http://mems.mcnc.org to find out about TechNet's inital process
offerings and participate in our User and Provider Surveys.


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