Hello All,

I've been trying some low budget Thermal Silicon Fusion Bonding with
limited success.  I've done .3um SiO2 on both wafers, one wafer with
oxide/ one without, and both striped of any oxide.  I've tried the wafers
wet, dry, with a weight and without.  Always ramping up to 1100C at
10C/min in a tube furnace, with the wafer in at 1100C for 5hrs.
My best method has been one wafer with oxide and one without, stuck
together with water.  I got about 50% bonded.

Any help would be appreciated.

Thanks,

(microfab junkie)
Mark Crain
Research Assistant
University of Louisville
mmcrai01@starbase.spd.louisville.edu

(microfab junkie)