I just read an article in Laser Focus World on using UV as a way of breaking
bonds between dust and a wafer surface. Is it possible to do the same thing
with micromaching stiction?

Justin.
--
Justin Mansell          |       "Only torture will bring
EMAIL:jdm6@po.cwru.edu  |           out the truth."
1262 Cook Ave.          |
Cleveland, OH  44107    |               - C.S. Lewis