What are the options of releasing a
thick (30-40um) silicon beam from the
frontside. One possible option would be
DRIE.
Any other...?
The backside is etched using KOH until
a thick si beam is left, which needs to
be released from the frontside.

Suggestions are appreciated!!

Thanks,

************************************
Kavita Chandra
MEMS Design Engineer
Wilcoxon Research Inc.
(301)216-3032 -voice
(301)330-8873 -Fax
www.wilcoxon.com