Dear Rich Hjulstrom,

In the work that I have seen if the bonding is done correctly, you should
see bulk fracture occur before the silicon-to-silicon or silicon-to-glass
interface separates. If you have problems with this please contact us.
Best Regards,

Andy Mirza
Technology Manager

EV Group-Technology, Tel: (602) 437 9492 x 112, Fax: (602) 437 9435
E-mail: a.mirza@evgroup.com < mailto:a.mirza@evgroup.com>, Web
www.EVGroup.com

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-----Original Message-----
From: RAH@moore-solutions.com [ mailto:RAH@moore-solutions.com]
Sent: Thursday, May 11, 2000 6:39 AM
To: MEMS@ISI.EDU
Subject: Bond strength of Si-Si bonds


Hello all:
I'm trying to determine quantitatively the strength of silicon-to-silicon
bonds compared to anodically bonded silicon-to-glass bonds. I'm interested
in bond strength when applying pressure to a cavity etched in one of the
silicon wafers in the bonded pair. Applied pressures will range from 500-
4000 psi. I'd appreciate any data or resources that you may know of in this
regard.
Thanks

Rich Hjulstrom
Siemens Moore Process Automation, Inc.
(215) 646-7400 x2420
(215) 591-0420 Fax
mailto:rah@moore-solutions.com
http:\www.moore-solutions.com