Dear Sir, There is a French (small) company wich may solve your problem : GAMBERINI Sarl http://www.microelectronics-sc.com/ Best regards. Yahong Yao wrote: > Hi, All, > > I wonder which company provides wafer dicing service? Mine is silicon > substrate with MEMS devices on. I want to cut some trenches on the substrate > so that the devices can be easily split after release. > Thanks in advance. > > Yahong > _______ -- Olivier de Gabrielli - Coordinateur Scientifique A. C. M. I. Association Capteurs, Mesure et Instrumentation. Centre Universitaire de Formation et de Recherche d'Archamps Immeuble "Le Salève" F - 74166 ARCHAMPS - France Tel: 33 (0)450 31 55 10 Fax: 33 (0)450 31 57 21 mailto:odegabrielli@c4i.fr mailto:acmi@c4i.fr http://www.c4i.fr/welacmi/acmi.html _________________________________________________________