Oliver,

EV Group has already more than two years of experience in spray-coating
photoresist on substrates with topography.
The various applications are covering standard wafer coating (with deeply
etched grooves and/or raised structures) as well as coating of substrates
with different shape.
Our proprietary OmniSprayTM method is used as a universal alternative to
coating methods like spin coating, roller coating or dip coating.
Spray coating may go beyond the limitations of spin coating technique and
introduce better uniformity and conformality of the photoresist layer.

For further information please contact:

EV Group E.Thallner GmbH
St.Florian Gewerbegebiet
4780 Schärding, Austria
Tel. +43 7712 5311-0
Fax +43 7712 5311-46

Or visit our web site: www.EVGroup.com  .

Best regards,
Thomas Luxbacher

EV Group -Product Management- Tel: +43 7712 5311-0, Fax: ext. 46, e-mail:
 t.luxbacher@EVGroup.at
 www.EVGroup.com


-----Original Message-----
From:   Oliver Powell [mailto:O.Powell@me.gu.edu.au]

Sent:   Freitag, 25. August 2000 06:59
To:     MEMS@ISI.EDU 
Subject:        Spray on photoresist??

Dear Mems people

I am trying to perform a second photolithography step on islands which I
have etched to a height of 20 to 40 microns.  Unfortunately I am finding
that my photoresist seems to runn off and end up in puddles at the bottom of
the islands and much too thin on the top (or not at all)
I was thinking of spraying on my photo resist instead of spinning.  Has
anybody tried this??  Can anybody suggest another way to avoid this problem.
cheers
Olly Powell
School of microelectronic engineering
Griffith University
Australia