Dear MEMS colleague: I met some problem on gold wire bonding(packaging), and I highly appreciate your kind instructions. I grow SiO2 on Silicon wafer, then deposit gold film on the SiO2. When I make gold wire bonding to the gold film on SiO2, I met problem, the gold wire pull off a small hole on gold film after 1st bonding, it cannot stick with the gold film. Could you please give me some instructions? Any information is appreciated. Thank you in advance. My email: xxghl@yahoo.com have a nice day! Xiong __________________________________________________ Do You Yahoo!? Yahoo! Photos - 35mm Quality Prints, Now Get 15 Free! http://photos.yahoo.com/