Xiong: Gold will not stick to SiO2. After you grow SiO2 on Si, deposit a thin layer of Ti or Cr (few A thick), you can generate a mask to preferentially deposit Ti or Cr at only those areas where you plan to deposit gold. After this step try to deposit gold, the Ti or Cr thin layer bonds very well to Au and also to Si or SiO2. Jayant ***************************************** Jayant Neogi CEO Norsam Technologies Ph 503-640-0586/503-356-9197 Fax 503-640-8117/503-356-9197 http://www.norsam.com ***************************************** -----Original Message----- From: Michael Xiong [mailto:xxghl@yahoo.com] Sent: Monday, October 09, 2000 7:41 PM To: mems-out@ISI.EDU Cc: mems@ISI.EDU Subject: gold wire bonding problem Dear MEMS colleague: I met some problem on gold wire bonding(packaging), and I highly appreciate your kind instructions. I grow SiO2 on Silicon wafer, then deposit gold film on the SiO2. When I make gold wire bonding to the gold film on SiO2, I met problem, the gold wire pull off a small hole on gold film after 1st bonding, it cannot stick with the gold film. Could you please give me some instructions? Any information is appreciated. Thank you in advance. My email: xxghl@yahoo.com have a nice day! Xiong __________________________________________________ Do You Yahoo!? Yahoo! Photos - 35mm Quality Prints, Now Get 15 Free! http://photos.yahoo.com/