Hi,
     I am looking for some inputs on how to infiltrate a microstructure with
silicon. This structure is quite complex with many layers (>10) and I need
to infiltrate the gaps in all the layers with Si. I can only do a one-sided
deposition. We have had very little success with CVD type processes (done at
various temps, pressures), because of pinch-off.

I am trying to find out if this structure can be filled from a silicon melt,
preferrably a high pressure silicon melt. If so, I would appreciate any
ideas on where I might be able to do this.

Thanks in advance.

--- Aravind


Aravind Padmanabhan
Honeywell Laboratories
612.954.2970 (phone)
612.954.2504 (fax)