Hi everyone, I need to deposit about 5 microns of metal( copper, gold, anything) on silicon wafer. Since we don't have CVD or sputtering facility, electroplating seemed like a good idea. I don't need the metal layer to have very good electrical characteristics. Whatever reference I have come across about electroplating on silicon, talks about some seed metal layer already present on the wafer. Can anyone tell me what is the conventional way of getting that seed layer? Is it by electroless plating? If so, what are the conditions (e.g. activation steps, plating solution, temp etc.)? Any step-by-step guide or reference about it will be most welcome. Thank you all in advance, With best regards, Ms.Debjani Pal Research Scholar (Semiconductor Group) Department of Physics Ph: (080)309-2316 Indian Institute of Science Fax:(080)334-1683 Bangalore - 560012