Dear all:
  Now I have some questions on anodic bonding after CMOS or
Bipolar process.

First, is nitride enough to protect circuits from Sodium
contamination?
Second, can the CMOS or Bipolar transistor not be breaked
through with such high voltage needed by anodic bonding?
Third, is it very easy to bond them even the silicon planar
is not very smmoth?

I know there are many successful example to anodic bond the
silicon wafer with circuits to the glass. Then I hope you
could give me some hints about them.

Thanks a million,

Sincerely,
Gang Li