Dear MEMS community,
I am looking for information on glass frit materials. I want to use them to
bond fused silica wafers. Anodic or fusion bonding can not be used because
there are thick conductor lines at the bond interface. I am looking for the
following information

1] vendor contact information
2] materials which contain no organic binders
3] Process information such as uniformity data. I want to spin coat wafers
and achieve a nominal 25 micron thick layer +/- 2 microns.

Any input would be much appreciated.

Sincerely,
Tom Wester

ProcessTek
PO Box 315
Lynnfield, MA 01940
office 781-595-1355
fax 781-595-9582
tom_wester@ieee.org