Dear colleagues,

We are interested in acquiring wafers (silicon, sapphire, quartz, or
ceramics) with 4" recess. The depth of the recess should be around 200~250
micron. There may also be need for wafers with 2" recesses that's 100~140
micron deep. Depending on the wafer material, the wafer thickness will be
specified according to the density to keep the weight similar to that of a
6" silicon wafer. The quantity of need is small (< 100) and depends on the
cost.

If there is a supplier or bulk micromachining facility that can provide
such wafers, please contact me at (203) 207-9354. I'm also interested, to a
lesser extent, in the reduction process where the outer 1" perimeter of 6"
silicon wafer is chopped off to reduce the wafer to a 4" size.

Barry Chen, Research Engineer
ATMI, Materials LifeCycle Solutions