Hello

I am trying to dice up some samples on an SOI substrate for waveguiding
applications.  I have a problem that the device layer always has little
chips near the edge after the saw cut,  and I haven't managed to polish
them out yet.

Can somebody suggest:
1.  An ingenious sawing technique that won't chip the edges.
(covering the sample in a very hard material for example)

or 2.   A mechanical polishing technique that won't take until the next ice
age to produce clean waveguide ends.


Thanks very much


Olly Powell
School of MEE
Griffith University
Australia