Hi All,

i'm trying to bond a 500 micron glass wafer with the 0.2 micron aluminum layer
deposited on the tope, with another glass wafer using anodic bonding technique.
if anybody has done something similar and can share hes/her experience ,
will greatly appreciate that.
Bonding parameters such as temperature, voltage will be particulary helpful.

Thanks in advance,

Nikolai Markarian
Mechanical Engineering Department
New Jersey Institute of Technology.
e-mail: nxm7499@njit.edu