Disco has a 300 series dicing saw with an IR scope.  Contact Lyons &
Associates, Joe Raffa (215) 750-6346 832 Belleveu Ave., Hulmeville, PA 19047
for further details.  I do not know how good this equipment  works.
Regards,

Jeff

Jeffery J Gilbert

Rm 22Y-168 EO
555 Union Boulevard
Allentown, PA 10103-1229
Ph # (610)712-7129
Fax # (610)712 7208
email: jjg6@agere.com


        ----------
        From:  Dean Eshleman [SMTP:dreshleman@earthlink.net]
        Sent:  Friday, February 09, 2001 8:40 PM
        To:  MEMS@ISI.EDU
        Subject:  Backside wafer alignment & sawing without polishing

        Has anyone had success in finding/developing a dicing saw with a
vision
        system that can see through the backside of the wafer onto the
surface
        circuitry for alignment purposes WITHOUT having to backpolish the
wafer?

        I have seen standalone vision tests done using IR on a 7405m thick
wafer
        with slightly grainy results, but good enough for a human to
decipher.
        1) Are there any better vision solutions out there? or
        2) Is there imaging software that can take grainy results and
process it in
        a way suitable for automatic alignment/pattern recognition on a
dicing saw?

        Your advice/experience is much appreciated,
        Dean R. Eshleman