You might start with John Lau's recent text "Low Cost Flip Chip Technologies
for DCA, WLCSP, and PBGA Assemblies,"  ISBN: 0071351418.
IEEE CPMT Journals [3 related journals as of recently] are a good up to date
source. See December volumes for their Annual Indices.

Advanced Packaging magazine
http://ap.pennnet.com/home.cfm

and HDI magazine
http://www.hdi-online.com/

are good sources as well.

Good luck,


Michael Alderete
Lead Mechanical Packaging Engineer
Sensor & Electronic Systems
The Boeing Company
3370 Miraloma Ave MC GB21 Bldg 231
P.O Box 3105
Anaheim CA 92803-3105

michael.alderete@boeing.com
TEL (714) 762-2814
FAX (714) 762-6105
 -----Original Message-----
From:   cheol-hyun_han@agilent.com [mailto:cheol-hyun_han@agilent.com]
Sent:   Thursday, February 08, 2001 3:18 PM
To:     MEMS@ISI.EDU
Subject:        Reference book for wafer-level packaging

Does anybody know good reference book (or review papers) regarding
wafer-level packaging (or any packaging)?
Thanks.
Cheol Han
Agilent Technologies