Announcing the Second Multi-Project LIGA run

MCNC, in conjunction with the University of Wisconsin, and with support from
ARPA, is pleased to announce the second multiproject LIGA run scheduled for
this fall/winter.

This run will feature 2 distinct processes, both completely releasable. One
process will be a 150 micron tall electroplated nickel process with a milled
final surface. This process can be used for all/any structures with a minimum
line width of 5.0 microns or greater, AND a length-to-width aspect ratio of
10.0 or less.

The second process, which is offered specifically to accommodate those
participants interested in producing gratings, is a 30 micron tall
electroplated nickel process. The top surface will not be milled. This process
has also has a 5.0 micron minimum geometry, but has no length-to-width aspect
ratio restriction.

Detailed design rules and layout examples will be provided to all interested
users. Contact koester@mcnc.org, 919 248 1493 for LIGA rules (rule handouts
will be available starting week of sept 5) and reservations.

The design deadline is OCTOBER 31, 1994.

Layout support is available (contact cowen@mcnc.org, 919 248 1424). If you
desire layout support from MCNC, your design requirements are due NO LATER THAN
OCTOBER 17th.

The run cost is $600. Five (5) die will be delivered.

The number of available die are limited, reservations are on a first-come,
first-served basis. Payment is due with your design submission.

Please DO NOT CONTACT THE UNIVERSITY OF WISCONSIN for information, reservations
or rules. All activity will be handled by MCNC.