Hugo,

Did you try the higher temperature wafer grip (120 C softening point
temperature) or regular wafer grip (95 C softening point temperature)? The
higher temperature wafer grip works much better, so I suggest you that a try
Good luck.


Ukay Ukoha-Ajike
Technical Manager, Opto Chip Fab, Agere Systems.
610.939.7844, Pg: 888.798.0181, ukay@agere.com



-----Original Message-----
From: Hugo Jazo [mailto:hjazo@spawar.navy.mil]
Sent: Thursday, August 23, 2001 10:50 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Wafer Bonding


I've been using high temperature wax for wafer bonding - backgrinding - and
eventual TMAH etching.  The problem is, there is always some bit of
separation of the wax around the edges of the wafer.  I've also tried a
product called wafergrip with not much more success.  Does anyone know of a
product that can bond two wafers together, withstand a TMAH etch, and hold
together when subjected to 100 C?

Thank you,


Hugo Jazo
SPAWAR Systems Center, San Diego (SSC-SD)
Integrated Circuit Research and Fabrication, D876
49375 Ashburn Rd.
San Diego, CA 92152-7633
Ph: 619-553-3826          Fax: 619-553-5667
hjazo@spawar.navy.mil

_______________________________________________
mems-talk mailing list
mems-talk@memsnet.org
To unsubscribe or change your list options, use:
 http://fab.mems-exchange.org/mailman/listinfo/mems-talk