We have extensively used electroplated gold as an interconnect metal, for
wirebonding without problems

Shekhar
> From:           robert s okojie ee stnt 
> Subject:        wire bonding
> Date sent:      Fri, 24 May 96 12:03:05 EDT
> To: MEMS@ISI.EDU
> Send reply to: mems@ISI.EDU

> Dear members,
>
> I have been working on gold interconnects for low temperature applications.
> However, at >600deg.C, the gold wire begins to diffuse into the top platinum
> layer.
>
> The major effect of this is to reduce time of failure in terms of
> device performance.
>
> Does anyone have a suggestion as to what binary metallization(top metal +
> wire interconnect) scheme could be implemented without any evident
> interfacial disturbance at 600deg.C.
>
> Your response to this and any relating information will be appreciated.
>
>
> Thank you.
>
> Robert S. Okojie (Ph.D)
> Kulite Semiconductor Products, Inc.
> 1 Willow Tree Road
> Leonia, NJ 07605
> (201)461-0900
> e-mail rso6948@hertz.njit.edu
>
>
> Dept of Electrical Engineering,
Royal Melbourne Institute of Technology,
Australia
Tel: +61 3 9660 1722
Fax: +61 3 9660 2007