Dear Prem Pal,
There are several candidates that could solve your problems and fit your
needs....I will mention a couple that we at MicroChem are aware of and
manufacture....
PMGI - PMGI is a polymer that lends itself very nicely to this
application...It is spin coatable to a wide variety of Film
Thicknesses....It planarises very easily under controlled bake
conditions....Requires the use of Standard Resist processing
techniques..And can be removed easily by using standard photoresist
developers or removers....
LOR - Is a PMGI based resist layer, generally used in a bi-layer scheme
as a Lift-Off Resist....It's dissolution rate in aqueous developers is
inherently faster than PMGI and may be better suited as a sacrificial
layer....Again this product is available in a wide variety of film
thicknesses....This product has been used successfully as a sacrificial
layer beneath SU-8 in MEMS applications.....Requires the use of Standard
Resist processing techniques..And can be removed easily by using
standard photoresist developers or removers....
I hope this is of use to you....If you need any more information please
contact me....
Mark Shaw
Product Development & Applications Manager
MicroChem Corp.
1254 Chestnut Street,
Newton, MA. 02464
Tel : 617-965-5511 ext.308
Fax : 617-965-5818
-----Original Message-----
From: mems-talk-request@memsnet.org
[mailto:mems-talk-request@memsnet.org]
Sent: Monday, September 24, 2001 12:01 PM
To: mems-talk@memsnet.org
Subject: mems-talk digest, Vol 1 #52 - 6 msgs
Send mems-talk mailing list submissions to
mems-talk@memsnet.org
To subscribe or unsubscribe via the World Wide Web, visit
http://fab.mems-exchange.org/mailman/listinfo/mems-talk
or, via email, send a message with subject or body 'help' to
mems-talk-request@memsnet.org
You can reach the person managing the list at
mems-talk-admin@memsnet.org
When replying, please edit your Subject line so it is more specific
than "Re: Contents of mems-talk digest..."
Today's Topics:
1. BCB and bonding (daria_doria@tin.it)
2. material for sacrifacial layer (Prem Pal)
3. Density of Polysilicon (Aitor Endemano)
4. vendor for 12inch Pt and NiCr target (Biao Li)
5. Re: replacement for strain gauges (e.calius@irl.cri.nz)
6. Making small diameter holes in glass (Danny Klein)
--__--__--
Message: 1
From:
To: mems-talk@memsnet.org
Date: Fri, 21 Sep 2001 18:15:41 CEST
Subject: [mems-talk] BCB and bonding
Dear All,
we are looking for information about bonding with BCB.
Does anybody know how BCB works with high temperature? Is it
thermosensitive? Does its adhesion change with temperature?
Let us know
D.Doria
--__--__--
Message: 2
From: "Prem Pal"
To: mems-talk@memsnet.org
Date: Fri, 21 Sep 2001 16:43:42 +0000
Subject: [mems-talk] material for sacrifacial layer
hello friends
I am trying to find out the material which can be spin coated on
surface topography and can be planerise by using CMP or some other means
and finally can be used as a sacrifacial layer in surface micromachining
technology. any kind of information about this material would be
highly appreciated.
thax in advance
>
Get your FREE download of MSN Explorer at http://explorer.msn.com
Get your FREE download of MSN
Explorer at http://explorer.msn.com
--__--__--
Message: 3
From: Aitor Endemano
Reply-To: A.Endemano@hw.ac.uk
To: mems-talk@memsnet.org
Date: Fri, 21 Sep 2001 18:57:43 +0100 (GMT Daylight Time)
Subject: [mems-talk] Density of Polysilicon
Dear colleagues,
Does anybody know the typical value for the density of the polysilicon.
Cheers,
Aitor Endemano Isasi
-------------------------------------------------------------
Aitor Endemano Isasi - PhD Student
Dpt. of Computing & Electrical Eng.
Heriot Watt University - Riccarton
Edinburgh EH14 4AS - SCOTLAND
Tlf: +44 (0)131 449 5111 ext.4159
Fax: +44 (0)131 451 3327
E-mail: A.Endemano@hw.ac.uk
--__--__--
Message: 4
From: Biao Li
To: "'mems-talk@memsnet.org'"
Date: Fri, 21 Sep 2001 20:58:24 -0400
Subject: [mems-talk] vendor for 12inch Pt and NiCr target
Hello,
we need 12-inch Pt and NiCr targets for MRC sputtering system. any
information about vendors are appreciated.
Biao Li
--__--__--
Message: 5
Date: Mon, 24 Sep 2001 10:19:40 +1200
From: e.calius@irl.cri.nz
Organization: Industrial Research Limited
To: Conrad Trevelyan
CC: mems-talk@memsnet.org
Subject: Re: [mems-talk] replacement for strain gauges
If you're interested in measuring the strain on the surface of a part,
in the
same way as you would with a strain gage, then the only MEMS device that
I'm
aware of is the BiAST (BiAxial Strain Transducer) being developed by
Sarcos
(http://www.sarcos.com/memsspec_uast.html).
It is actually better described as a micro-extensometer rather than a
strain
gage, but with a gage length of around 10 millimeters, its output should
be
similar to that of a small strain gage. The most interesting features
are:
* practical resolution of the order of 1 microstrain.
* onboard A/D conversion, so that the sensor actually communicates
digitally
with the data acquisition system with the obvious consequences for
noise.
* potentially reusable, as the MEMS device package is attached by
something like
screws to the stems of 3 mounting pads which are bonded to the surface
whose
strain is to be measured. This is important because initially, at least,
these
sensors will be considerably more expensive than normal strain gages.
These devices will hopefully become available in the next few months. If
you'd
like some more information, I can forward a couple of papers in PDF
format.
There are of course non-MEMS alternatives to electrical strain gages
based on
fibre optics.
If you learn of any other MEMS-based strain measurement devices, please
let us
know.
-- Emilio
---------------------------------------------------------------------
Dr Emilio P. Calius
Research Engineer: Smart Materials and Structures
Industrial Research Limited
PO Box 2225, Auckland, New Zealand
Ph: +64 9 303 4116, Fax: +64 9 307 0618
--__--__--
Message: 6
From: "Danny Klein"
To:
Date: Mon, 24 Sep 2001 14:34:17 +0200
Subject: [mems-talk] Making small diameter holes in glass
This is a multi-part message in MIME format.
------=_NextPart_000_0007_01C14505.FD98FF20
Content-Type: text/plain;
charset="iso-8859-1"
Content-Transfer-Encoding: quoted-printable
Dear MEMS colleagues,
As a part of my thesis I am interested in making several small =
diameter holes (100-200 micron) in a thin layer of glass (400-500 =
micron), along a 20 mm line. Then I need to fill the holes with gold or
=
any other metal.
I would like to know if anyone knows any methods to drill or etch =
those holes in glass ( Pyrex, BK-7, CdTe, BaF2 or any other material =
that allows transmission in the visible and IR wavelengths as well).
I would appreciate if anyone can tell me of a manufacturer that can make
=
these holes.=20
=20
P.S. I choose glass because of its relative high thermal isolation =
property.
Thank you in advance,
Danny Klein
-----------------------------------------------------
Danny Klein
Faculty of Mechanical Engineering
Technion, Israel Institute of Technology
Haifa, 32000
Israel
Tel: 972-4-8292946
Email: dannykl@tx.technion.ac.il
----------------------------------------------------
------=_NextPart_000_0007_01C14505.FD98FF20
Content-Type: text/html;
charset="iso-8859-1"
Content-Transfer-Encoding: quoted-printable
Dear MEMS colleagues,
As a part of my thesis I =
am=20
interested in making several small diameter holes (100-200 micron) in a
=
thin=20
layer of glass (400-500 micron), along a 20 mm line. Then I need to fill
=
the=20
holes with gold or any other metal.
I would like to know =
if anyone=20
knows any methods to drill or etch those holes in glass ( Pyrex, =
BK-7,=20
CdTe, BaF2 or any other material that allows transmission in the visible
=
and=20
IR wavelengths as well).
I would appreciate if anyone can tell me
=
of a=20
manufacturer that can make these holes.
P.S. I choose glass because of =
its relative=20
high thermal isolation property.
Thank you in advance,
Danny Klein
-----------------------------------------------------
Danny Klein
Faculty of Mechanical Engineering
Technion, =
Israel=20
Institute of Technology
Haifa, 32000
Israel
Tel: 972-4-8292946
Email: dannykl@tx.technion.ac.il<
/=
DIV>
----------------------------------------------------
------=_NextPart_000_0007_01C14505.FD98FF20--
--__--__--
_______________________________________________
mems-talk mailing list
mems-talk@memsnet.org
http://fab.mems-exchange.org/mailman/listinfo/mems-talk
End of mems-talk Digest