Dear Yong,

I am not certain if the spin will damage the released structures or not, but
another item you may need to concern yourself with is the overall coating
uniformity itself.  Released structures such as you are referring to can
play havoc with the flow properties of spun photoresist.  You may want to
look into alternate technologies, such as spray coating.  This could also
solve your concerns about damage, as well, since the wafer would only be
spun at approximately 60 rpm, and the overall force from the spray nozzle is
actually very small, since the photoresist is atomized using nitrogen,
rather than forced through a fan-spray nozzle.

Best Regards,

Chad Brubaker

 <>

EV Group-Technology, Tel: (602) 437 9492 x 111, Fax: (602) 437 9435
E-mail: C.Brubaker@evgroup.com, Web: www.EVGroup.com, Date: 09/27/01


 -----Original Message-----
From:   Yong Zhu [mailto:yzhu@northwestern.edu]
Sent:   Wednesday, September 26, 2001 11:23 PM
To:     mems-talk@memsnet.org
Subject:        [mems-talk] spin photoresist after releasing the structure

Hello, MEMS friends;

Does anyone have experience to spin photoresist after releasing the
structure, such as comb drive?
I am wondering if the spin will damage the suspended device. I would like to
get some idea before
I make the design. Thank you.

Yong
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