Hi Yong, I have managed to spin coat after release with very little damage to the structures on the die. The sample I was using was a 1 square centimeter die from the MUMPS process, and included 4-micron-wide wandering-beam tethers that might have a similar structure to the digits on your comb drive. I ran the spinner at 4000 RPM with Shipley 1813 photoresist. I repeated this with multiple dice, and even up to three times on the same die with only very slight damage. I have found MEMS structures from the MUMPS process to be remarkably resilient. I once accidentally dropped a die butter-side-down in the spinner bowl, and was still able to continue experimenting on the chip! You may find that you have trouble with stiction following the photolithography. To resolve this problem, I emmersed the chip in water after pattern transfer was complete, and then performed a CO2 critical-point dry. This worked rather well for me. Best of luck with your research! -Craig McGray Dartmouth College > From: "Yong Zhu"> To: > Date: Thu, 27 Sep 2001 01:22:48 -0500 > Subject: [mems-talk] spin photoresist after releasing the structure > > Hello, MEMS friends; > > Does anyone have experience to spin photoresist after releasing the structure, such as comb drive? > > I am wondering if the spin will damage the suspended device. I would like to get some idea before > I make the design. Thank you. > > Yong