Dear Adnan,
When you process the S1818 do you perform a hard bake step ?.....You may
find that the inclusion of this step will reduce the amount of shrinkage
you are experiencing....Conditions for Hard Bake for this resist are 150
deg C for a couple of minutes on a hotplate.... You may also want to
re-evaluate the softbake process...The recommended soft bake is 115 deg
C for 1-2 minutes on a hotplate.....
If you need any more information please contact me at 617-965-5511 ext
308 or by return of email.....
Mark Shaw
Product Development & Applications Manager
MicroChem Corp
-----Original Message-----
From: mems-talk-request@memsnet.org
Sent: Thu 9/27/2001 12:01 PM
To: mems-talk@memsnet.org
Cc:
Subject: mems-talk digest, Vol 1 #55 - 5 msgs
Send mems-talk mailing list submissions to
mems-talk@memsnet.org
To subscribe or unsubscribe via the World Wide Web, visit
http://fab.mems-exchange.org/mailman/listinfo/mems-talk
or, via email, send a message with subject or body 'help' to
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You can reach the person managing the list at
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When replying, please edit your Subject line so it is more
specific
than "Re: Contents of mems-talk digest..."
Today's Topics:
1. gold electroplating (Adnan Merhaba)
2. Re: PZT supplier (Rajsekhar Popuri)
3. Pi -44 (piezo coefficient) for Si{100} along [110]
direction (anant narain)
4. spin photoresist after releasing the structure (Yong Zhu)
5. ion implanter foundry service (Mounir.Ennabli@ibsen.dk)
--__--__--
Message: 1
To: mems-talk@memsnet.org
From: "Adnan Merhaba"
Date: Wed, 26 Sep 2001 13:33:40 -0400
Subject: [mems-talk] gold electroplating
Hello,
My name is Adnan Merhaba and I am a process engineer with the
American
technical ceramics. I have a question regarding pattern plating
of gold, we
are currently using a cyanide bath and use 1818 photoresist to
mask the
areas not to be plated, however during the plating process, we
often find
that the resist shrinks, and hence plating occurs in region
where it is not
supposed to. Does anyone know the root cause of this and what
are the
possible solutions to avoid it?
Thank you
Regards,
Adnan
--__--__--
Message: 2
From: "Rajsekhar Popuri"
To: mems-talk@memsnet.org
Date: Wed, 26 Sep 2001 14:00:05 -0400
Subject: [mems-talk] Re: PZT supplier
Hi li shifeng,
Physik Instrumente (PI), Germany are the leading producers of
PZT.
They have offices in US also.You can call them at 508-832-3456
(Auburn,
MA).Also for futher info check thier website www.polytecpi.com.
Regards
Popuri Rajsekhar.
>From: mems-talk-request@memsnet.org
>Reply-To: mems-talk@memsnet.org
>To: mems-talk@memsnet.org
>Subject: mems-talk digest, Vol 1 #53 - 6 msgs
>Date: Tue, 25 Sep 2001 12:01:03 -0400
>
>Send mems-talk mailing list submissions to
> mems-talk@memsnet.org
>
>To subscribe or unsubscribe via the World Wide Web, visit
> http://fab.mems-exchange.org/mailman/listinfo/mems-talk
>or, via email, send a message with subject or body 'help' to
> mems-talk-request@memsnet.org
>
>You can reach the person managing the list at
> mems-talk-admin@memsnet.org
>
>When replying, please edit your Subject line so it is more
specific
>than "Re: Contents of mems-talk digest..."
>
>
>Today's Topics:
>
> 1. RE: material for sacrificial layer (Mark Shaw)
> 2. Re: Density of Polysilicon (shankar)
> 3. young's modulus,compliance coeff, poission ratio ofSi in
><110>direction (anant narain)
> 4. Making small diameter holes in glass (Debjyoti Banerjee)
> 5. PZT SUPPLIER (li shifeng)
> 6. Re: vendor for 12inch Pt and NiCr target (oray orkun
cellek)
>
>-- __--__--
>
>Message: 1
>Date: Mon, 24 Sep 2001 12:20:08 -0400
>From: "Mark Shaw"
>To:
>Subject: [mems-talk] RE: material for sacrificial layer
>
>Dear Prem Pal,
>
>There are several candidates that could solve your problems and
fit your
>needs....I will mention a couple that we at MicroChem are aware
of and
>manufacture....
>
>PMGI - PMGI is a polymer that lends itself very nicely to this
>application...It is spin coatable to a wide variety of Film
>Thicknesses....It planarises very easily under controlled bake
>conditions....Requires the use of Standard Resist processing
>techniques..And can be removed easily by using standard
photoresist
>developers or removers....
>
>LOR - Is a PMGI based resist layer, generally used in a
bi-layer scheme
>as a Lift-Off Resist....It's dissolution rate in aqueous
developers is
>inherently faster than PMGI and may be better suited as a
sacrificial
>layer....Again this product is available in a wide variety of
film
>thicknesses....This product has been used successfully as a
sacrificial
>layer beneath SU-8 in MEMS applications.....Requires the use of
Standard
>Resist processing techniques..And can be removed easily by
using
>standard photoresist developers or removers....
>
>I hope this is of use to you....If you need any more
information please
>contact me....
>
>Mark Shaw
>Product Development & Applications Manager
>MicroChem Corp.
>1254 Chestnut Street,
>Newton, MA. 02464
>=20
>Tel : 617-965-5511 ext.308
>Fax : 617-965-5818
>=20
>
>
>
>-----Original Message-----
>From: mems-talk-request@memsnet.org
>[ mailto:mems-talk-request@memsnet.org]
>Sent: Monday, September 24, 2001 12:01 PM
>To: mems-talk@memsnet.org
>Subject: mems-talk digest, Vol 1 #52 - 6 msgs
>
>
>Send mems-talk mailing list submissions to
> mems-talk@memsnet.org
>
>To subscribe or unsubscribe via the World Wide Web, visit
> http://fab.mems-exchange.org/mailman/listinfo/mems-talk
>or, via email, send a message with subject or body 'help' to
> mems-talk-request@memsnet.org
>
>You can reach the person managing the list at
> mems-talk-admin@memsnet.org
>
>When replying, please edit your Subject line so it is more
specific
>than "Re: Contents of mems-talk digest..."
>
>
>Today's Topics:
>
> 1. BCB and bonding (daria_doria@tin.it)
> 2. material for sacrifacial layer (Prem Pal)
> 3. Density of Polysilicon (Aitor Endemano)
> 4. vendor for 12inch Pt and NiCr target (Biao Li)
> 5. Re: replacement for strain gauges (e.calius@irl.cri.nz)
> 6. Making small diameter holes in glass (Danny Klein)
>
>-- __--__--
>
>Message: 1
>From:
>To: mems-talk@memsnet.org
>Date: Fri, 21 Sep 2001 18:15:41 CEST
>Subject: [mems-talk] BCB and bonding
>
>Dear All,
>
>we are looking for information about bonding with BCB.
>Does anybody know how BCB works with high temperature? Is it
>thermosensitive? Does its adhesion change with temperature?
>Let us know
>D.Doria
>
>
>
>-- __--__--
>
>Message: 2
>From: "Prem Pal"
>To: mems-talk@memsnet.org
>Date: Fri, 21 Sep 2001 16:43:42 +0000
>Subject: [mems-talk] material for sacrifacial layer
>
>
>
hello friends
>I am trying to find out the material which can be spin
coated on
>surface topography and can be planerise by using CMP or some
other means
>and finally can be used as a sacrifacial layer in surface
micromachining
>technology. any kind of information about this
material would be
>highly appreciated.
>
>thax in advance
>>
>
>
>
>
>Get your FREE download of MSN Explorer at href=3D" http://go.msn.com/bql/hmtag_itl_EN.asp">
http://explorer.msn.comA
> >
>
Get your FREE download of
MSN
>Explorer at href=3D' http://go.msn.com/bql/hmtag_itl_EN.asp'>
http://explorer.msn.coma
> >
>
>
>-- __--__--
>
>Message: 3
>From: Aitor Endemano
>Reply-To: A.Endemano@hw.ac.uk
>To: mems-talk@memsnet.org
>Date: Fri, 21 Sep 2001 18:57:43 +0100 (GMT Daylight Time)
>Subject: [mems-talk] Density of Polysilicon
>
>Dear colleagues,
>Does anybody know the typical value for the density of the
polysilicon.
>Cheers,
>
>Aitor Endemano Isasi
>
>
>-------------------------------------------------------------
>Aitor Endemano Isasi - PhD Student
>Dpt. of Computing & Electrical Eng.
>Heriot Watt University - Riccarton
>Edinburgh EH14 4AS - SCOTLAND
>Tlf: +44 (0)131 449 5111 ext.4159
>Fax: +44 (0)131 451 3327
>E-mail: A.Endemano@hw.ac.uk
>
>
>
>-- __--__--
>
>Message: 4
>From: Biao Li
>To: "'mems-talk@memsnet.org'"
>Date: Fri, 21 Sep 2001 20:58:24 -0400
>Subject: [mems-talk] vendor for 12inch Pt and NiCr target
>
>Hello,
>=20
>we need 12-inch Pt and NiCr targets for MRC sputtering system.
any
>information about vendors are appreciated.
>
>Biao Li
>
>
>-- __--__--
>
>Message: 5
>Date: Mon, 24 Sep 2001 10:19:40 +1200
>From: e.calius@irl.cri.nz
>Organization: Industrial Research Limited
>To: Conrad Trevelyan
>CC: mems-talk@memsnet.org
>Subject: Re: [mems-talk] replacement for strain gauges
>
>
>If you're interested in measuring the strain on the surface of
a part,
>in the
>same way as you would with a strain gage, then the only MEMS
device that
>I'm
>aware of is the BiAST (BiAxial Strain Transducer) being
developed by
>Sarcos
>( http://www.sarcos.com/memsspec_uast.html).
>
>It is actually better described as a micro-extensometer rather
than a
>strain
>gage, but with a gage length of around 10 millimeters, its
output should
>be
>similar to that of a small strain gage. The most interesting
features
>are:
>
>* practical resolution of the order of 1 microstrain.
>* onboard A/D conversion, so that the sensor actually
communicates
>digitally
>with the data acquisition system with the obvious consequences
for
>noise.
>* potentially reusable, as the MEMS device package is attached
by
>something like
>screws to the stems of 3 mounting pads which are bonded to the
surface
>whose
>strain is to be measured. This is important because initially,
at least,
>these
>sensors will be considerably more expensive than normal strain
gages.
>
>These devices will hopefully become available in the next few
months. If
>you'd
>like some more information, I can forward a couple of papers in
PDF
>format.
>
>There are of course non-MEMS alternatives to electrical strain
gages
>based on
>fibre optics.=20
>
>If you learn of any other MEMS-based strain measurement
devices, please
>let us
>know.
>
>-- Emilio
>
>---------------------------------------------------------------------
>Dr Emilio P. Calius
>Research Engineer: Smart Materials and Structures
>Industrial Research Limited
>PO Box 2225, Auckland, New Zealand
>Ph: +64 9 303 4116, Fax: +64 9 307 0618
>
>
>-- __--__--
>
>Message: 6
>From: "Danny Klein"
>To:
>Date: Mon, 24 Sep 2001 14:34:17 +0200
>Subject: [mems-talk] Making small diameter holes in glass
>
>This is a multi-part message in MIME format.
>
>------=3D_NextPart_000_0007_01C14505.FD98FF20
>Content-Type: text/plain;
> charset=3D"iso-8859-1"
>Content-Transfer-Encoding: quoted-printable
>
>Dear MEMS colleagues,
>
> As a part of my thesis I am interested in making several
small =3D
>diameter holes (100-200 micron) in a thin layer of glass
(400-500 =3D
>micron), along a 20 mm line. Then I need to fill the holes with
gold or
>=3D
>any other metal.
> I would like to know if anyone knows any methods to drill
or etch =
>=3D
>those holes in glass ( Pyrex, BK-7, CdTe, BaF2 or any other
material =3D
>that allows transmission in the visible and IR wavelengths as
well).
>I would appreciate if anyone can tell me of a manufacturer that
can make
>=3D
>these holes.=3D20
> =3D20
>P.S. I choose glass because of its relative high thermal
isolation =3D
>property.
>
>Thank you in advance,
>
>Danny Klein
>
>-----------------------------------------------------
>
>Danny Klein
>Faculty of Mechanical Engineering
>Technion, Israel Institute of Technology
>Haifa, 32000
>Israel
>
>Tel: 972-4-8292946
>Email: dannykl@tx.technion.ac.il
>
>----------------------------------------------------
>
>
>------=3D_NextPart_000_0007_01C14505.FD98FF20
>Content-Type: text/html;
> charset=3D"iso-8859-1"
>Content-Transfer-Encoding: quoted-printable
>
>
>
>charset=3D3Diso-8859-1">
>
>
>
>
>Dear MEMS colleagues,
>
> As a part of my
thesis I =
>=3D
>am=3D20
>interested in making several small diameter holes (100-200
micron) in a
>=3D
>thin=3D20
>layer of glass (400-500 micron), along a 20 mm line. Then I
need to fill
>=3D
>the=3D20
>holes with gold or any other metal.
> I would like to
know =3D
>if anyone=3D20
>knows any methods to drill or etch those holes in glass (
Pyrex, =
>=3D
>BK-7,=3D20
>CdTe, BaF2 or any other material that allows transmission in
the visible
>=3D
>and=3D20
>IR wavelengths as well).
>I would appreciate if anyone
can tell =
>me
>=3D
>of a=3D20
>manufacturer that can make these holes.
>
>P.S. I choose glass
because of =
>=3D
>its relative=3D20
>high thermal isolation property.
>
>Thank you in advance,
>
Danny Klein
>color=3D3D#0000ff>
>-----------------------------------------------------
>
>Danny Klein
Faculty of Mechanical
Engineering
Technion, =3D
>Israel=3D20
>Institute of Technology
Haifa, 32000
Israel
>
>Tel: 972-4-8292946
Email: href=3D3D"
mailto:dannykl@tx.technion.ac.il">dannykl@tx.technion.ac.il=
><
>/=3D
>DIV>
>
>----------------------------------------------------
>
>
>------=3D_NextPart_000_0007_01C14505.FD98FF20--
>
>
>
>
>-- __--__--
>
>_______________________________________________
>mems-talk mailing list
>mems-talk@memsnet.org
> http://fab.mems-exchange.org/mailman/listinfo/mems-talk
>
>
>End of mems-talk Digest
>
>
>-- __--__--
>
>Message: 2
>Date: Mon, 24 Sep 2001 22:35:54 -0700 (PDT)
>From: shankar
>cc: mems-talk@memsnet.org
>Subject: Re: [mems-talk] Density of Polysilicon
>
>this website might help you.....
> http://www-bsac.eecs.berkeley.edu/polysilicon.html
>regds,
>Ravi Shankar
>Semiconductor complex ltd,
>India.
>
>
>
>On Fri, 21 Sep 2001, Aitor Endemano wrote:
>
> > Date: Fri, 21 Sep 2001 18:57:43 +0100 (GMT Daylight Time)
> > From: Aitor Endemano
> > To: mems-talk@memsnet.org
> > Subject: [mems-talk] Density of Polysilicon
> >
> > Dear colleagues,
> > Does anybody know the typical value for the density of the
polysilicon.
> > Cheers,
> >
> > Aitor Endemano Isasi
> >
> >
> >
-------------------------------------------------------------
> > Aitor Endemano Isasi - PhD Student
> > Dpt. of Computing & Electrical Eng.
> > Heriot Watt University - Riccarton
> > Edinburgh EH14 4AS - SCOTLAND
> > Tlf: +44 (0)131 449 5111 ext.4159
> > Fax: +44 (0)131 451 3327
> > E-mail: A.Endemano@hw.ac.uk
> >
> >
> > _______________________________________________
> > mems-talk mailing list
> > mems-talk@memsnet.org
> > To unsubscribe or change your list options, use:
> > http://fab.mems-exchange.org/mailman/listinfo/mems-talk
> >
>
>
>
>-- __--__--
>
>Message: 3
>Date: Mon, 24 Sep 2001 10:13:44 -0700 (PDT)
>From: anant narain
>To: mems-talk@memsnet.org
>Subject: [mems-talk] young's modulus,compliance coeff, poission
ratio ofSi
>in <110>direction
>
>hi!
>
>i am student doing M.Tech (microelectronics and vlsi
>design) from I.I.T.Kharagpur,India.
>i am presently working in MEMS and developing a
>piezoresistive accelerometer.
>
>i wish to know the elastic constt. of Si in <110>
>direction specifically the Young's modulus,poisson's
>ratio, and compliance coeff. along <110>
>
>thanks,
>great regards,
>anant narain
>Get email alerts & NEW webcam video instant messaging with
Yahoo!
>-- __--__--
>
>Message: 4
>Date: Mon, 24 Sep 2001 12:44:33 -0700
>From: Debjyoti Banerjee
>Organization: Coventor Inc.
>To: mems-talk@memsnet.org
>Subject: [mems-talk] Making small diameter holes in glass
>
>This is a multi-part message in MIME format.
>--------------68B53AF76C6A02F4CD929875
>Content-Type: text/plain; charset=us-ascii
>Content-Transfer-Encoding: 7bit
>
>You may want to try Lamda-Physik (
http://www.lambdaphysik.com/). They do
>laser beam machining on Silicon and Glass with hole diameters
down to 1um.
>In the web page - look under Service & Support / Applications
Lab
>Capabilities. Hope this helps.
>
>Debjyoti.
>
>mems-talk-request@memsnet.org wrote:
>
> > Message: 6
> > From: "Danny Klein"
> > To:
> > Date: Mon, 24 Sep 2001 14:34:17 +0200
> > Subject: [mems-talk] Making small diameter holes in glass
> >
> > This is a multi-part message in MIME format.
> >
> > ------=_NextPart_000_0007_01C14505.FD98FF20
> > Content-Type: text/plain;
> > charset="iso-8859-1"
> > Content-Transfer-Encoding: quoted-printable
> >
> > Dear MEMS colleagues,
> >
> > As a part of my thesis I am interested in making several
small =
> > diameter holes (100-200 micron) in a thin layer of glass
(400-500 =
> > micron), along a 20 mm line. Then I need to fill the holes
with gold or
>=
> > any other metal.
> > I would like to know if anyone knows any methods to
drill or etch =
> > those holes in glass ( Pyrex, BK-7, CdTe, BaF2 or any other
material =
> > that allows transmission in the visible and IR wavelengths
as well).
> > I would appreciate if anyone can tell me of a manufacturer
that can make
>=
> > these holes.=20
> > =20
> > P.S. I choose glass because of its relative high thermal
isolation =
> > property.
> >
> > Thank you in advance,
> >
> > Danny Klein
> >
> > -----------------------------------------------------
> >
> > Danny Klein
> > Faculty of Mechanical Engineering
> > Technion, Israel Institute of Technology
> > Haifa, 32000
> > Israel
> >
> > Tel: 972-4-8292946
> > Email: dannykl@tx.technion.ac.il
> >
> > ----------------------------------------------------
> >
> > ------=_NextPart_000_0007_01C14505.FD98FF20
> > Content-Type: text/html;
> > charset="iso-8859-1"
> > Content-Transfer-Encoding: quoted-printable
> >
> >
> >
> > > charset=3Diso-8859-1">
> >
> >
> >
> >
> > Dear MEMS
colleagues,
> >
> > As a part of
my thesis I =
> > am=20
> > interested in making several small diameter holes (100-200
micron) in a
>=
> > thin=20
> > layer of glass (400-500 micron), along a 20 mm line. Then I
need to fill
>=
> > the=20
> > holes with gold or any other metal.
> > I would like
to know =
> > if anyone=20
> > knows any methods to drill or etch those holes in glass
( Pyrex, =
> > BK-7,=20
> > CdTe, BaF2 or any other material that allows transmission in
the visible
>=
> > and=20
> > IR wavelengths as well).
> > I would appreciate if anyone
can tell me
>=
> > of a=20
> > manufacturer that can make these holes.
> >
> > P.S. I choose glass
because of =
> > its relative=20
> > high thermal isolation property.
> >
> > Thank you in
advance,
> >
Danny Klein
> > > color=3D#0000ff>
> >
-----------------------------------------------------
> >
> > Danny Klein
Faculty of Mechanical
Engineering
Technion, =
> > Israel=20
> > Institute of Technology
Haifa, 32000
Israel
> >
> > Tel: 972-4-8292946
Email: >
>href=3D"
mailto:dannykl@tx.technion.ac.il">dannykl@tx.technion.ac.il > DIV>
> >
> >
----------------------------------------------------
> >
> >
> > ------=_NextPart_000_0007_01C14505.FD98FF20--
> >
> > -- __--__--
> >
> > _______________________________________________
> > mems-talk mailing list
> > mems-talk@memsnet.org
> > http://fab.mems-exchange.org/mailman/listinfo/mems-talk
> >
> > End of mems-talk Digest
>
>--
>Debjyoti "Deb" Banerjee, Ph.D.
>Senior Consulting Engineer
>Coventor Inc. (formerly Microcosm Tech.)
>7 Corporate Park, Suite 260
>Irvine, CA 92606.
>
>Ph: (949) 756 5681
>Mobile: (650) 743 2373
>Fax: (949) 756 0070
>
>Email: debban@coventor.com
>URL: http://www.coventor.com
>
>
>--------------68B53AF76C6A02F4CD929875
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> name="debban.vcf"
>Content-Transfer-Encoding: 7bit
>Content-Description: Card for Debjyoti Banerjee
>Content-Disposition: attachment;
> filename="debban.vcf"
>
>begin:vcard
>n:Banerjee, Ph.D.;Debjyoti
>tel;cell:650 743 2373
>tel;fax:949 756 0070
>tel;work:949 756 5681
>x-mozilla-html:FALSE
>url: http://www.coventor.com
>org:Coventor Inc.;Professional Services
>adr:;;7 Corporate Park, Suite 260;Irvine;CA;92606;USA
>version:2.1
>email;internet:debban@coventor.com
>title:Senior Consulting Engineer
>fn:Debjyoti Banerjee, Ph.D.
>end:vcard
>
>--------------68B53AF76C6A02F4CD929875--
>
>
>
>-- __--__--
>
>Message: 5
>From: "li shifeng"
>To: mems@ISI.EDU
>Date: Mon, 24 Sep 2001 23:54:17
>Subject: [mems-talk] PZT SUPPLIER
>
>
>
>Dear friends
>I want to some pieces of PZT actuator.please give me some
information
>about PZT supplier, in particular in US.
>
>thanks
>shifeng Li
Get
your FREE
>download of MSN Explorer at href=' http://go.msn.com/bql/hmtag_itl_EN.asp'>
http://explorer.msn.com
>
>
>-- __--__--
>
>Message: 6
>From: "oray orkun cellek"
>To: "Biao Li" ,
>
>Subject: Re: [mems-talk] vendor for 12inch Pt and NiCr target
>Date: Tue, 25 Sep 2001 10:08:48 +0300
>
>I heard that Kurt-Lesker can produce custom targets for
sputtering systems
>.
>(www.lesker.com)
>
>Oray Orkun CELLEK
>o.o.cellek@ieee.org
>
>----- Original Message -----
>From: Biao Li
>To:
>Sent: Saturday, September 22, 2001 3:58 AM
>Subject: [mems-talk] vendor for 12inch Pt and NiCr target
>
>
> > Hello,
> >
> > we need 12-inch Pt and NiCr targets for MRC sputtering
system. any
> > information about vendors are appreciated.
> >
> > Biao Li
> >
> > _______________________________________________
> > mems-talk mailing list
> > mems-talk@memsnet.org
> > To unsubscribe or change your list options, use:
> > http://fab.mems-exchange.org/mailman/listinfo/mems-talk
> >
>
>
>
>-- __--__--
>
>_______________________________________________
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Message: 3
Date: Wed, 26 Sep 2001 12:15:39 -0700 (PDT)
From: anant narain
To: mems-talk@memsnet.org
Subject: [mems-talk] Pi -44 (piezo coefficient) for Si{100}
along [110] direction
hi!
i need some help regarding the value of pi-44
(piezocoeff.) of p-Si{100} along <110> direction.
along <100> piezo coeff are:
pi-11 :+6.6
pi-12 :-1.1
pi-44 :+138.1
i have done some calculations, and tranformed the
values along <100> to new values along <110> but i am
not sure!!
along <110> i have got:
pi-11 :+71.8
pi-12 :-66.3
pi-44 :?
kindly help!!
thanks,
great regards,
anant narain
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Message: 4
From: "Yong Zhu"
To:
Date: Thu, 27 Sep 2001 01:22:48 -0500
Subject: [mems-talk] spin photoresist after releasing the
structure
Hello, MEMS friends;
Does anyone have experience to spin photoresist after releasing
the
structure, such as comb drive?
I am wondering if the spin will damage the suspended device. I
would like to
get some idea before
I make the design. Thank you.
Yong
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Message: 5
To: mems-talk@memsnet.org
From: Mounir.Ennabli@ibsen.dk
Date: Thu, 27 Sep 2001 09:57:48 +0200
Subject: [mems-talk] ion implanter foundry service
Dear members,
I am looking for a foundry that can supply us with ion
implantation
services. We are starting a production of sensors and need a
reliable
supplier.
Please let me know if you know of a supplier.
Mounir Ennabli M.Sc. E.E
Development Engineer
Grundfos as
Direct: +45 44 34 71 58
Fax: +45 44 34 71 72
mounir_ennabli@adc.com
Mailing Address: Ryttermarken 15-21, 3520 Farum Denmark
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